Infrared transmission micro via and trench inspection device for MEMS/TSV.
MEMS device inspection equipment (MEMS micro-hole depth measurement, pattern inspection)
As a MEMS device inspection system, we offer a fine hole depth measurement device and a pattern inspection device. The fine hole depth measurement device utilizes an infrared camera and a special algorithm to enable the measurement of the depth of non-through holes with a diameter of less than 20 μm, which is typically impossible to measure. The pattern inspection device is an automatic infrared image processing inspection system that uses an infrared microscope and an electric stage to automatically detect defects. It can save the position, size, and images of the defective areas, and is used for inspection purposes in MEMS (micro-machines). For more details, please contact us.
- Company：ディスク・テック 本社
- Price：Other
